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        歡迎來到深圳市旭崇自動化設備有限公司網站!專業的邦定機廠家,為您免費提供邦定機、貼合機、ACF貼附機等相關信息發布和最新資訊,敬請關注!

        旭崇 FOG/FOB 邦定設備 XCH77-A6

        文章出處:http://www.kickzpro.com/news686874.html發布時間:2019-07-31 00:00:00

        旭崇 FOG/FOB 邦定設備 XCH77-A6

        FOG/FOB Bonding M/C


         

        Application:

        本產品適用于各種液晶屏(LCD PANEL)、觸摸功能玻璃(SENSOR GLASS)、硬質線路板(PCB、PCBA)與柔性線路板(FPC、COF、TAB)在FOG、FOB工藝中的熱壓邦定。

         

        The machine is used for bonding all kinds of FPC, COF, TAB and liquid crystal screen panel (LCD PANEL), SENSOR GLASS, PCB, and PCBA multi stations assembly.

         

        Details:

        高清影像系統   High definition visual system

        兩段獨立溫控系統   Temperature controlling

        LED光源控制器   LED light controller

        X軸氣缸定位卡   X-axis locating part

        X-Y-θ壓頭調節機構  Adjusting group of pressure head

        X-Y-Z軸機構   Group of X-Y-Z Moving Axis

        安全光柵保護裝置  Grating protection

        FPC工作平臺X-Y-θ調節機構  Micrometer adjuster

        靜電消除裝置   Anti-static Device

        PCB、COF托架   PCB, COF bracket

        CCD對位機構    CCD aligning group

         

        Introduction:

        1 開機復位,設備回原點

        2 點擊人機界面進入自動模式

        3 人工從左邊上料,X Y 向定位卡定位,按下真空,平臺將Panel 吸附,X定位卡下降

        4 按下雙手啟動,Panel 平臺移載到視覺對位處

        4 PCB 放置于平臺上,按PCB 真空按鍵,PCB 平臺將PCB 吸住, Panel 平臺Z軸下降至邦定位

        5 手動調節PCB 治具X-Y-θ 進行對位

        6 按下雙啟動按鈕,Panel 平臺移栽到邦定位,下壓、邦定

        7 邦定完成后,平臺移動到下一個邦定位,段位邦定完成回到下料位,人工下料

         

        1. Start and reset machine, the machine go back to origin.

        2. Enter auto mode.

        3. Put panel onto platform and positioned by locating parts. Turn on vacuum to attach panel, X axis locating part goes down.

        4. Put PCB onto fixture, press vacuum button to attach it, panel platform down to bonding position.

        5. Adjust PCB fixture manually to align with panel.

        6. Press double start button, platform moves to bonding position, pressure head goes down to bond.

        7. Bonding finished, platform moves to next bonding position (can set multi-station bonding), platform moves to discharge area.

         

        Parameters:

        輸入電源:AC380V 50-60HZ

        Input power: AC380V 50-60HZ

        額定功率:7KW

        Rated power: 7KW

        工作氣壓:0.4-0.7Mpa

        Working pressure: 0.4-0.7 Mpa

        壓頭尺寸:L230mm×W2.0mm(可定制)

        Size of Pressure Head: L230mm×W2.0mm (can be customized)

        加熱方式:恒溫

        Method of heating: Constant temperature

        對位方式:上下CCD 對位

        Method of Alignment: CCD top and bottom alignment

        壓頭機構:電機+氣缸

        Group of Pressure Head: Motor + Cylinder

        LCD載臺:X-Y-Z 3軸電機驅動

        LCD Platform: X-Y-Z motor driving

        控制系統:日本松下PLC+ pro人機界面

        Controlling System:  Panasonic PLC+ pro touch screen

        外型尺寸:L1500*W1200*H2200MM(含報警燈)

        Dimension: L1500*W1200*H2200MM (include alarm lamp)

        真空處理:真空泵

        Vacuum Processing: Vacuum Pump

        設備重量:850KG(以實物為準)

        Weight of Machine: 850KG (prevail in kind)

         

        Features:

        1 高清影像系統:2CCD上對位另加十字線顯示器精準對位,也可根據工藝需求定制上下CCD機構

        2 兩段獨立溫度系統:等比例分切、多溫區控制、精準通訊,確保溫度精準性

        3 LED光源控制器:同軸光鏡頭光源可根據產品工藝需求調整,可滿足OGS、FILM-TP、GLASS-TP、液晶屏、電子紙等不同類型的對位成像

        4 X軸氣缸定位卡:左進左出的上料方式便于單人同方向操作,X-Y-Z活動的定位卡裝置,更便捷地保證產品的位置精度

        5 X-Y-θ 壓頭調節機構:調節方便,壓頭水平度高;自動卷皮輪,邦定完成可自動卷動熱壓皮,頻率及長度均可設置

        6 X-Y-Z 軸機構:載臺X-Y-Z伺服控制,滿足OGS、FILM-TP、GLASS-TP、液晶屏、電子紙等不同類型的產品在FOG、FOB、OLB、PWB等多位置邦定工藝中的需求

        7 安全光柵保護裝置:更好保證了操作人員因操作失誤帶來的人員傷害

        8 FPC 工作平臺 X-Y-θ 調節機構:X-Y-θ 千分尺調節夾具組。真空吸附,達到快速定位,提高效率

        9 靜電消除裝置:可降低靜電對產品的需求,同時避免因氣流所導致的溫度差異和對位影響

        10  PCB、COF托架:應用在多段邦定中,由于多段產品邦定X軸移動過程中的重力下垂所導致的不良及不便捷

        11 CCD對位機構:采用千分尺X-Y-Z精準調節,調焦便捷,精確

         

        1. 2 CCD top alignment and special display guarantee aligning accuracy, CCD top or bottom alignment can be customized.

        2. Multi-section temperature controlling guarantees the temperature accuracy.

        3. Camera light source can be adjusted as needed, suitable for imaging OGS, FILM-TP, GLASS-TP, LCD, EPD PANEL.

        4. Left side loading and discharging is easy to operate by one operator, and X-Y-Z locating parts guarantee locating accuracy of products.

        5. Adjusting group of pressure head is easy to operate, Collector of silicone rubber can roll automatically, rolling frequency and length can be set.

        6. Servo controlling of platform is suitable for multi station bonding of OGS, FILM-TP, GLASS-TP, LCD, EPD PANEL in FOG, FOB, OLB, PWB process.

        7. With the design of grating protection, the machine can avoid injuries caused by operational errors.

        8. Fixture is adjusted by micrometer adjuster and with vacuum attaching function that can position fast.

        9. Anti-static device can deduce impact from static to products, and also can avoid temperature difference and aligning accuracy caused by airflow.

        10. PCB, COF bracket are used in multi section, it can avoid defective caused by hang down during moving in X multi station bonding.

        11. CCD aligning group adopt micrometer adjuster which is convenient to focus and with high accuracy.

         

        Process:

        FOG、OLB邦定  FOG, OLB Bonding

        FOB、PWB邦定  FOB, PWB Bonding

         

        Accessories:

        感壓紙  Sensitive Paper

        ACF    ACF

        硅膠皮   Silicone Rubber

        ACF去除液   ACF Remover

        無塵布  Dust-free Cloth

        酒精  Ethanol

        棉棒  Cotton Swab